Product Descriptions
Ra-01S-P is a LoRa series module. This module is used for ultra long distance spread spectrum communication, and its RF chip SX1268 mainly adopts LoRaT remote modem for ultra long distance spread spectrum communication. It has strong anti-interference ability and can minimize current consumption. With the help of SEMTECH's LoRaTM patented modulation technology, the module is equipped with a power amplifier (PA) and a low noise amplifier (LNA) based on this technology, with high sensitivity exceeding -137dBm and transmission power of+29dBm, long transmission distance, and high reliability. Meanwhile, compared to traditional modulation techniques, LoRaTM modulation technology also has significant advantages in anti blocking and selection, solving the problem that traditional design schemes cannot simultaneously consider distance, anti-interference, and power consumption.
Product Specifications
| 模組型號 Module model | Ra-01S-P |
| 模組封裝 Module packaging | SMD-16 |
| 尺寸(mm) Size(mm) | 17.0*16.0*3.2(±0.2)MM |
| 天線形式 Antenna form | 兼容半孔焊盤/通孔焊盤/IPEX 座子 Compatible with half hole solder pads/through-hole solder pads/IPEX sockets |
| 頻譜范圍 Spectrum range | 410*525MHz |
| 工作環(huán)境 Work environment | -40℃~85 ℃ |
| 存儲環(huán)境 Storage environment | -40℃~125°C,<90%RH |
| 供電范圍 Power supply range | 供電電壓 3.0~3.6V，典型值 3.3V，電流大于1A Supply voltage of 3.0~3.6V, typical value of 3.3V, current greater than 1A |
| 支持接口 Support interfaces | SPI |
| 可編程比特率 Programmable Bit Rate | Up to 300kbps |
The Ra-01S-P module has a total of 16 pins connected, as shown in the pin diagram. The pin function definition table is the interface definition:
| 腳序 Foot sequence | 名稱 Name | 功能說明 Function Description |
| 1 | ANT | 接天線 Connect antenna |
| 2 | GND | 接地 Grounding |
| 3 | 3V3 | 典型值3.3V供電 Typical 3.3V power supply |
| 4 | RESET | 復位腳 Reset foot |
| 5 | CPS | FEM 芯片 TX直通使能腳，發(fā)射模式時該腳低電平RF不經 PA 放大直接輸出，內部默認上拉 The FEM chip TX enable pin has a low level RF output without PA amplification during transmission mode, and is internally pulled up by default |
| 6 | DIO1 | 數(shù)字IO1軟件配置 Digital IO1 software configuration |
| 7 | DIO2 | 數(shù)字IO2軟件配置 Digital IO2 software configuration |
| 8 | DIO3 | 數(shù)字IO3軟件配置 Digital IO3 software configuration |
| 9 | GND | 接地 Grounding |
| 10 | BUSY | 狀態(tài)指示燈引腳 Status indicator pin |
| 11 | RF_EN | FEM芯片使能腳，高電平有效，模組內部默認上拉；高電平處于工作狀態(tài)，低電平處于睡眠狀態(tài) FEM chip enable pin, high level effective, default pull-up inside the module; High level is in working state, low level is in sleep state |
| 12 | SCK | SPI時鐘輸入 SPI clock input |
| 13 | MISO | SPI數(shù)據(jù)輸出 SPI data output |
| 14 | MOSI | SPI數(shù)據(jù)輸入 SPI data input |
| 15 | NSS | SPI片選輸入 SPI chip selection input |
| 16 | GND | 接地 Grounding |
| EPAD | GND | 接地，需可靠接地，利于散熱 Grounding, reliable grounding is required to facilitate heat dissipation |
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